P84 Polyimide Solution Technical Information | High Performance Polymer Coating

 

P84®Polyimide

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P84 Polyimide Solution Technical Information

Technical Information

Thermal Properties - P84-polyimide Coating


Glass transition point: 315°C
(Tg)  
   
Decompositiontemp.: >550°C
(Onset)  
   
10 % loss of weight: in air: 525°C
  in nitrogen: 570°C

No melting point

Limiting Oxygen Index (LOI): 38% 02

(ASTM D2863)
(25µ without substrate)




Chemical Properties

  • Fully imidized
  • Excellent chemical resistance to acids reaching to the neutral side of the pH scale
  • Excellent resistance to all normal organic solvents, oils and fuels e.g.: nitric acid, hydrchloric acid, acetic acid, formic acid, oxalic acid, ethylene glycol, acetone, benzene, diglycolic methyl ether, methylene glycol, perchioro ethylene, tetrachloro ethane, toluene and tricloroethylene
  • Contact with caustic or base media should be avoided
  • Solubility in high polar solvents such as dimethylformamide (DMF), N-methylpyrrolidone (NMP), etc.

P84 Polyimide

P84 HT Polyimide




Typical Viscosity

Solutions in DMF

Type 70: 25 % ( + 2 % ) solid content in DMF delivery viscosity : 60 - 80 Pa . s

Type 15: 25 % ( + 2 % ) solid content in DMF delivery viscosity : 10 - 20 Pa , s

Solution - Grade - Granulate

solid P84 polyimide for dissolving in NMP, DMSO, DMAc,

Viscosity versus solid content in NMP

( Typical Solution-Grade-Granulate )


Solutions in NMP

are available from 5 - 35 % solid content in NMP




TYPICAL ELECTRICAL PROPERTIES OF 50µ P 84 - POLYIMIDE COATING


Dielectric strength:  
DC 415 V / µ
AC (50 Hz) 280 V / µ
   
Dielectric constnat: 3,5
(50 Hz, absolutly dry)  
   
Dissipation factor: 0,001
(1 kHz)  
   
Volume resistivity: 1017Ω.cm
   
Refractive index: 1,68
(650-770 mm)  

Tests as per DIN 53481, DIN 53483




DISSOLVING PROCEDURE SOLUTION GRADE GRANULATE

( P84-Polyimide "SGG" )

# Dissolving procedure:

Put desired quantity of granulate into clean and dry flask or container. - Add accurate volume of NMP - Close the container tightly and shake imediately and contineousely to avoid agglomeration. Put immediately on a roil jack and dissolve at low speed for 72 hours at room temperature.

# Recommendet solvent:

N-Methipyrrolidone (NMP)

# Limit of possible solid content:

appr. 30 %

# Important note:

Do not use high speed mixers for acceleration of dissolving process. Also do 'nt heat solution.

# Drawing of roll jack:




Processing

  • Application by casting, dipping, spin-coating, spraying (only low viscosity) or roller coating
  • Non-compatibility with non-solvents (precipitation of polymer). Since the solvents used are hygroscopic, coagulation can also be triggered off by moisture
  • Do not use mixers with high shear rate to incorporate additives like fillers
  • Thermal drying without chemical reaction. Temperatures around T g wilt induce some crosslinking.



Rec. Drying Cycle

Softening-Temperature

Depending on Residual Solvent